Thermal Analysis: BETAsoft
BETAsoft is designed to plug into CADSTAR adding additional functionality and are easily accessed from the CADSTAR interface.
The BETAsoft programs have been well recognized as the leaders in thermal analysis software for over 15 years. BETAsoft-Board reveals the board temperatures and gradients, component and junction temperatures, and the amount they exceed their respective limits. The software supports space, avionic defense, telecom computer, automotive, medical, instrumentation, and power supply industries.
Outstanding Features:
Accurate and fast analysis: An accuracy of 10% has been consistently validated by our users and experimental wind tunnel and infrared image tests. The analysis performs fully 3-Dimensional modeling of the complex flow and thermal fields based on heat conduction, convection, and radiation. Finite difference schemes with self-adaptive locally refined meshes are used in the computation to produce extremely fast, yet accurate results.
Easy to use: BETAsoft-Board is fully menu driven, intuitive, and very easy to use. A library of 2500 components is provided, and new components can be easily created based upon their known package type. An automatic and seamless interface with Cadstar (or Visula) is available that will transfer:
- Component Partname
- Number of Pins
- Reference Designator
- Component Orientation
- Length
- Location on Board
- Width
- Board Size
... making data entry extremely easy. Colorful temperature and gradient maps create output that is easy to read and very impressive in reports.
Advanced Features: BETAsoft-Boards can evaluate boards of multi layers and irregular shapes. The board can be: placed at the edge or interior of a cabinet, anchored by screws to heat sinks, cooled through wedge locks at the edges, in a sealed compartment, or in an open system with forced convection. The flow field can be natural of forced convedtion, and closed systems can be cooled by heat exchangers. Effects of gravity, air pressures, and flow directions are modeled. Heat sinks, heat pipes, daughter boards, chip fans, and conduction pads can be attached to components or boards.
BetaSoft is provided by:
Dynamic Soft Analysis, Inc.
5001 Baum Blvd.
Suite 656
Pittsburgh, PA 15213
www.betasoft-thermal.com
beta@betasoft-thermal.com
Tel: 412-683-0161
Fax: 412-683-3641
Further Information
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